VLSI Interconnect Design Automation Using Quantitative and Symbolic Techniques - Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions

This paper presents a framework for design automation of VLSI interconnect geometries. Crosstalk, overshoot, undershoot, signal delay, and line impedance are design performance parameters under consideration. Since the dependence of electrical performance parameters on geometry is not easily defined, both qualitative and quantitative techniques are used. Two knowledge bases are introduced-a model and simulation base. The model base contains models used for terminations, transmission line parameter extractors, and transmission lines. The simulation knowledge base contains a set of approximations and routines for the exact evaluation of electrical performance parameters. Procedures are introduced for the automatic extraction of applicable models and simulation techniques in the design process. An unconstrained optimization routine is used as a design search technique. The approach presented here gives faster results than approaches shown in literature, with little sacrifice of accuracy.